There are two different fabrication methods for building complex micro devices: top-down and bottom-up approaches. Top-down approach based on conventional photolithography brought us amazing CMOS manufacturing triumph but it’s facing a fundamental limit in the scaling and cost. Recently, various bottom-up manufacturing technologies get the attention to overcome the limit of top-down manufacturing. Self-assembly is one promising way to lower manufacturing cost down significantly.
In this talk, I will present the concept of smart scalable system, a new bottom-up view point of building complex systems. First, optofluidic maskless lithography will be presented as a first step for smart particle generation. Second, various fluidic self-assembly technology such as railed microfluidics will be presented as smart particle assembly method. Then I will end with a few application examples such as encoded particle based scalable biosensor, LED packaging or scalable displays.