User login

Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip

Publication Type:

Journal Article

Source:

IEEE Optical Interconnects Conference (2015)

Abstract:

We demonstrate the integration of vertical-cavity surface-emitting lasers (VCSELs) with silicon photonics chip using flip-chip bonding technique, with bidirectional vertical-coupled grating coupler for light coupling.

Full Text:

Manuscript: http://www.mina.ubc.ca/files/2015_OIC_VCSELonSi.pdf
Poster: http://www.mina.ubc.ca/files/2015_OIC_VCSELonSi_slides.pdf

Faculty Member(s): 
Lukas.Chrostowski
Faculty Member(s): 
Nicolas.Jaeger
Research Area(s): 
Photonics and Optics