http://www.ampel.ubc.ca/nanofab/ This is a shared facility for the fabrication and characterization of advanced materials and devices. The laboratory is shared on a continual basis by 20 faculty and 60 students from UBC as well as about 6 faculty and a dozen students from SFU and UVic. Occasional users also come from other academic institutions and local small industry (eg. Angstrom Power, Ballard). The AMPEL Nanofabrication Facility is a fee-based service laboratory open to UBC and outside users. The facility is subsidized by an NSERC MFA grant, and provides highly reduced fee access for academic users.
The cleanroom consists of a gowning room, a class 1000 lithography room (35 sq m), a class 10000 thin-film room (48 sq m), and a class 10000 thin-film / metrology room (50 sq m). The cleanrooms are equipped for most micro- and nano-fabrication needs.
The lithography room houses 2 wetbenches, with equipment to spin on photoresist and
do wet chemistry, two mask aligners ch masks front align only and 4 inch masks with backside alignment) and a Nomarski microscope equipped with a CCD camera and computer capture. It also houses a Scanning Electron Microscope (SEM) that has been programmed for
electron-beam (e-beam) lithography. Also available in the yellow room is a dry clean bench, typically used for sample cleaving and preparation, and storage cabinets for the wet chemistry dishware.
The thin-film room houses a state of the art Electron Cyclotron Resonance (ECR) plasma etcher, with the following gases: Cl2, BCl3, O2, Ar, He. It also houses equipment for sputter, e-beam and thermal evaporation of metals and dielectrics, a Plasma Enhanced Chemical Vapor Deposition (PECVD) system for deposition of SiO2 and SiN films and also usable as a reactive ion etcher (RIE) using CF4 and O2 chemistry, two Rapid Thermal Annealling (RTA) ovens, a few conventional dry N atmosphere ovens, a Reactive Ion Etching (RIE) chamber with CH, a XeF etcher for Micro-Electro-Mechanical-Systems (MEMS) applications, a travelling probe alpha-step profilometer, and a wire bonder.
The class 10000 thin-film / metrology room is used for the following equipment: two thermal oxidation furnaces, and a Reactive Ion Etching (RIE) chamber with CF4, O2, N2, Ar, He gases. There is room for expansion for new equipment in this room.