%0 Journal Article %J IEEE Optical Interconnects Conference %D 2015 %T Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip %A Wang, Yun %A Djordjecvic, Stevan %A Yao, Jin %A Cunningham, John %A Zheng, Xuezhe %A Krishnamoorthy, Ashok %A Muller, Michael %A Amann, Markus-Christian %A Bojko, Richard %A Jaeger, Nicolas %A Chrostowski, Lukas %X We demonstrate the integration of vertical-cavity surface-emitting lasers (VCSELs) with silicon photonics chip using flip-chip bonding technique, with bidirectional vertical-coupled grating coupler for light coupling. %8 04/2015