%0 Journal Article %J Applied Physics Express %D 2012 %T Integration of Low-Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief %A Kaushik Ghosh and Chuan Seng Tan, Jiye Zhang Lin Zhang Yuanwei Dong Hongyu Li Cher Ming Tan Guangrui Xia %U http://apex.jsap.jp/link?APEX/5/126601/ %V 5 %8 11/2012