@article { Chiao:2006vn, title = {Device-level hermetic packaging of microresonators by RTP aluminum-to-nitride bonding}, journal = {JOURNAL OF MICROELECTROMECHANICAL SYSTEMS}, volume = {15}, number = {3}, year = {2006}, month = {Jun}, pages = {515--522}, type = {article}, abstract = {This paper presents a device-level microelectromechanical systems (MEMS) packaging process with accelerated tests and reliability analysis. Surface-micromachined microresonators are sealed inside microcavities by a rapid thermal processing (RTP) aluminum-to-silicon nitride bonding and packaging technique. Chipt-to-chip bonding is used to form packages both under atmospheric pressure and in vacuum. The hermeticity of the package seals are evaluated by IPA (isopropyl alcohol) leak tests. The vacuum seal is evaluated by measuring the Q-factor (quality factor) of the packaged microresonators. The measured Q-factor of a vacuum-packaged comb-resonator is 1800 +/- 200, corresponding to a 200 mtorr vacuum inside the micro cavity, and has not degraded over 37 weeks of shelf-life. The reliability information is evaluated by combining accelerated testing of the packages in a harsh environment (an autoclave chamber, 130 degrees C, 2.7 atm and 100% RH) and statistical analysis. The mean-time-to-failure (MTTF) of the packaged device is estimated as 29.7 weeks in an autoclave chamber, and tests on vacuum-packaged devices have confirmed the estimation.}, author = { Chiao, M. and Lin, L. W.} }