@inproceedings { 0097b_Correia-Cr, title = {A microinstrumentation system for industrial applications}, journal = {Industrial Electronics, 1997. ISIE '97., Proceedings of the IEEE International Symposium on , Guimar{\~a}es, Portugal, 7-11 July 1997}, year = {1997}, month = {1997}, pages = {846-850}, type = {inproceedings}, address = {Guimar{\~a}es, Portugal}, abstract = {This paper describes the development of a microinstrumentation system in silicon containing all the components of the data acquisition system, such as sensors, signal-conditioning circuits, analog-digital converter, interface circuits, sensor bus interface, and an embedded microcontroller (MCU). The microinstrumentation system is to be fabricated using the multi-chip-module (MCM) technology based on a chip-level infrastructure. A standard silicon platform is the floorplan for individual smart sensor die attachment and an on-chip local sensor bus interface, testing facilities, optional compatible sensors (such as thermal sensors). The microinstrumentation system is controlled by a MCU with several modes of low-power operation (inclusive stand-by mode). As the intended application requires a huge amount of data-processing, a RISC-type MCU architecture is to be used. The MCU communicates with the front-end sensors via a two-line (clock and data lines) intramodule sensor bus (Integrated Smart Sensor bus). The sensor scan rate is adaptive and can be event triggered. This upgraded version of the ISS bus allows: service and interrupt request from the sensors, test and calibration facilities. However, the additional functionality requires a third line. The MCU also controls the power consumption and the thermal budget of all systems. This paper also presents three applications for the microinstrumentation system: condition monitoring of machines, an inertial navigation system and a miniature spectrometer}, keywords = {analogue-digital conversion computerised instrumentation data acquisition inertial navigation microcontrollers microsensors multichip modules peripheral interfaces reduced instruction set computing testing thermal variables measurement Integrated Smart Se}, URL = {http://ieeexplore.ieee.org/search/srchabstract.jsp?arnumber=648651&isnumber=14135&punumber=5230&k2dockey=648651}, author = { Higino Correia, R.F. and E Cretu and M Bartek and RF Wolffenbuttel } }