@article { Wang2015, title = {Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip}, journal = {IEEE Optical Interconnects Conference}, year = {2015}, month = {04/2015}, abstract = {We demonstrate the integration of vertical-cavity surface-emitting lasers (VCSELs) with silicon photonics chip using flip-chip bonding technique, with bidirectional vertical-coupled grating coupler for light coupling.}, author = {Yun Wang and Stevan Djordjecvic and Jin Yao and John Cunningham and Xuezhe Zheng and Ashok V. Krishnamoorthy and Michael Muller and Markus-Christian Amann and Richard Bojko and Nicolas A. F. Jaeger and Lukas Chrostowski} }