@article { Dong2012TSV, title = {Integration of Low-Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief}, journal = {Applied Physics Express }, volume = {5}, year = {2012}, month = {11/2012}, URL = {http://apex.jsap.jp/link?APEX/5/126601/}, author = {Kaushik Ghosh, Jiye Zhang, Lin Zhang, Yuanwei Dong, Hongyu Li, Cher Ming Tan, Guangrui Xia, and Chuan Seng Tan} }